Patent Assignment
Reel/Frame 054170/0837
Assignment of Assignor's Interest
Recorded: 2020-10-26
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package, Optical Device, and Manufacturing Method of Package