IP Library › Assignment 054226/0106
Patent Assignment
Reel/Frame 054226/0106

Corrective Assignment to Correct the Assignment Document Previously Recorded at Reel: 034480 Frame: 0435. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2020-10-27 Pages: 8
Assignors
LEE, CHIEN-HSUN
Executed: 2014-01-21
WANG, TSUNG-DING
Executed: 2014-01-20
LII, MIRNG-JI
Executed: 2014-01-21
YU, CHEN-HUA
Executed: 2014-01-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Packages with Stacked Dies and Methods of Forming the Same
Patent: 9,984,999 →
Application: 15/147,574 →
Publication: US 2016/0247786
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 5, 2016
From: LEE, CHIEN-HSUN; WANG, DEAN; LII, MIRNG-JI; YU, CHEN-HUA
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 038480/0435 →