IP Library Assignment 054299/0921
Patent Assignment
Reel/Frame 054299/0921

Assignment of Assignor's Interest

Recorded: 2020-11-06 Pages: 18
Assignors
ALAAN, URUSA
Executed: 2020-11-05
LIN, KEVIN L.
Executed: 2020-09-24
RESHOTKO, MIRIAM
Executed: 2020-09-22
ATANASOV, SARAH
Executed: 2020-09-30
JEZEWSKI, CHRISTOPHER
Executed: 2020-09-22
NAYLOR, CARL
Executed: 2020-09-19
KOBRINSKY, MAURO
Executed: 2020-10-19
YOO, HUI JAE
Executed: 2020-10-07
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Damascene Interconnect Structures with Low Resistance Vias for Integrated Circuits
Application: 17/033,375 →
Publication: US 2022/0102268
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 14, 2026
From: INTEL CORPORATION
To: INTEL FOUNDRY IP LLC
Reel/Frame 076008/0065 →