IP Library Assignment 076008/0065
Patent Assignment
Reel/Frame 076008/0065

Assignment of Assignor's Interest

Recorded: 2026-09-14 Pages: 4
Assignor
INTEL CORPORATION
Executed: 2026-04-10
Assignee
INTEL FOUNDRY IP LLC
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (18)
Damascene Interconnect Structures with Low Resistance Vias for Integrated Circuits
Application: 17/033,375 →
Publication: US US20220102268A1
Ultra-Scaled Transistor Devices to Enable Cell Size Scaling
Application: 17/712,057 →
Publication: US US20230317794A1
Metal Chalcogenide Transistors with Defected Channel Transition Layer
Application: 17/560,069 →
Publication: US US20230197860A1
Sram with Nanoribbon Width Modulation for Greater Read Stability
Application: 17/560,779 →
Publication: US US20230209797A1
Recessed Transistor Terminal via Jumpers
Application: 17/711,875 →
Publication: US US20230320057A1
Programmable Capacitor Memory Arrays with Stacked Access Transistors
Application: 17/856,872 →
Publication: US US20240008291A1
Gate-All-Around Transistor Circuit Modification Using Direct Contact and/or Access Probe Points
Application: 17/856,777 →
Publication: US US20240006302A1
Build Up Material Architecture for Microelectronic Package Device
Application: 17/856,780 →
Publication: US US20240006296A1
High Endurance Super-Lattice Anti-Ferroelectric Capacitors
Application: 17/957,560 →
Publication: US US20240114695A1
Asymmetrical Dielectric-to-Metal Adhesion Architecture for Electronic Packages
Application: 17/848,053 →
Publication: US US20230420353A1
Ferroelectric Tunnel Junction Devices for Low Voltage and Low Temperature Operation
Application: 17/955,209 →
Publication: US US20240105811A1
Device, Method, and System to Mitigate Warpage of a Composite Chiplet
Application: 17/891,690 →
Publication: US US20240063143A1
Selective Ferroelectric Deployment for Single-Transistor, Multiple-Capacitor Devices
Application: 17/957,591 →
Publication: US US20240112714A1
Improved Replacement Electrode Process for 3D Ferroelectric Memory
Application: 17/957,603 →
Publication: US US20240114696A1
Singulation of Integrated Circuit Package Substrates with Glass Cores
Application: 17/957,349 →
Publication: US US20240113072A1
Air Gap Architecture for High Speed I/O Substrate Traces
Application: 17/958,012 →
Publication: US US20240113007A1
Directly Coupled Optical Interposer
Application: 17/957,341 →
Publication: US US20240111090A1
Electro-Optical Circuits with Modular Switchable Photonic Interface
Application: 18/090,260 →
Publication: US US20240219644A1
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 6, 2020
From: ALAAN, URUSA; LIN, KEVIN L.; RESHOTKO, MIRIAM; ATANASOV, SARAH
To: INTEL CORPORATION
Reel/Frame 054299/0921 →
Assignment of Assignor's Interest Jan 24, 2022
From: NAYLOR, CARL H.; MAXEY, KIRBY; DOROW, CHELSEY; LEE, SUDARAT
To: INTEL CORPORATION
Reel/Frame 058747/0588 →
Assignment of Assignor's Interest Mar 7, 2022
From: ONG, CLIFFORD; GULER, LEONARD; SHRIDHARAN, SMITA; GUO, ZHENG
To: INTEL CORPORATION
Reel/Frame 059188/0037 →
Assignment of Assignor's Interest Mar 9, 2022
From: NAYLOR, CARL H.; JEZEWSKI, CHRISTOPHER
To: INTEL CORPORATION
Reel/Frame 059214/0168 →
Assignment of Assignor's Interest Apr 18, 2022
From: ONG, CLIFFORD; GULER, LEONARD; HARAN, MOHIT; SHRIDHARAN, SMITA
To: INTEL CORPORATION
Reel/Frame 059627/0746 →
Assignment of Assignor's Interest May 19, 2022
From: SHARMA, ABHISHEK ANIL; GOMES, WILFRED; SUTHRAM, SAGAR; RANADE, PUSHKAR
To: INTEL CORPORATION
Reel/Frame 059960/0317 →
Assignment of Assignor's Interest Jun 23, 2022
From: NAD, SUDDHASATTWA; YANG, YI; STEILL, JASON; KONG, JIEYING
To: INTEL CORPORATION
Reel/Frame 060296/0309 →
Assignment of Assignor's Interest Jul 1, 2022
From: LIVENGOOD, RICHARD H.; RAZA, MUHAMMAD USMAN; ALI, WAQAS; MALIK, TAHIR
To: INTEL CORPORATION
Reel/Frame 060426/0435 →
Assignment of Assignor's Interest Jul 22, 2022
From: KONG, JIEYING; ABEYRATNE KURAGAMA, PEUMIE; OMER, ALA; WANG, AO
To: INTEL CORPORATION
Reel/Frame 060597/0589 →
Assignment of Assignor's Interest Sep 8, 2022
From: ELSHERBINI, ADEL; HIBBELER, LANCE C.; KARHADE, OMKAR; PAWASHE, CHYTRA
To: INTEL CORPORATION
Reel/Frame 061025/0587 →
Assignment of Assignor's Interest Sep 22, 2022
From: SHARMA, ABHISHEK ANIL; GHANI, TAHIR; MURTHY, ANAND; GOMES, WILFRED
To: INTEL CORPORATION
Reel/Frame 061180/0590 →
Assignment of Assignor's Interest Sep 30, 2022
From: BRYKS, WHITNEY; DARMAWIKARTA, KRISTOF; DUAN, GANG; DUONG, BENJAMIN
To: INTEL CORPORATION
Reel/Frame 061273/0154 →
Assignment of Assignor's Interest Oct 4, 2022
From: DUONG, BENJAMIN; DARMAWIKARTA, KRISTOF; PIETAMBARAM, SRINIVAS
To: INTEL CORPORATION
Reel/Frame 061303/0236 →
Assignment of Assignor's Interest Oct 4, 2022
From: MAY, ROBERT A.; IBRAHIM, TAREK; SESHADRI, SHRIYA; DARMAWIKARTA, KRISTOF
To: INTEL CORPORATION
Reel/Frame 061305/0972 →
Assignment of Assignor's Interest Nov 16, 2022
From: SHARMA, ABHISHEK ANIL; SUTHRAM, SAGAR; GHANI, TAHIR; MURTHY, ANAND
To: INTEL CORPORATION
Reel/Frame 061791/0503 →
Assignment of Assignor's Interest Nov 18, 2022
From: CHANG, SOU-CHI; HARATIPOUR, NAZILA; NEUMANN, CHRISTOPHER; SHIVARAMAN, SHRIRAM
To: INTEL CORPORATION
Reel/Frame 061823/0337 →
Assignment of Assignor's Interest Nov 18, 2022
From: HARATIPOUR, NAZILA; NEUMANN, CHRISTOPHER; DOYLE, BRIAN; CHANG, SOU-CHI
To: INTEL CORPORATION
Reel/Frame 062302/0072 →
Assignment of Assignor's Interest Nov 18, 2022
From: NEUMANN, CHRISTOPHER; WEINSTEIN, CORY; HARATIPOUR, NAZILA; DOYLE, BRIAN
To: INTEL CORPORATION
Reel/Frame 061824/0016 →
Assignment of Assignor's Interest Feb 13, 2023
From: NAD, SUDDHASATTWA; DUONG, BENJAMIN; TANAKA, HIROKI; MARIN, BRANDON
To: INTEL CORPORATION
Reel/Frame 062671/0181 →