Patent Assignment
Reel/Frame 061025/0587
Assignment of Assignor's Interest
Recorded: 2022-09-08
Pages: 14
Assignors
ELSHERBINI, ADEL
Executed: 2022-08-24
HIBBELER, LANCE C.
Executed: 2022-08-26
KARHADE, OMKAR
Executed: 2022-08-23
PAWASHE, CHYTRA
Executed: 2022-08-23
JUN, KIMIN
Executed: 2022-08-22
EID, FERAS
Executed: 2022-08-23
LIFF, SHAWNA
Executed: 2022-08-23
KABIR, MOHAMMAD ENAMUL
Executed: 2022-08-23
KRISHNATREYA, BHASKAR JYOTI
Executed: 2022-08-22
TALUKDAR, TUSHAR
Executed: 2022-08-29
LI, WENHAO
Executed: 2022-08-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Device, Method, and System to Mitigate Warpage of a Composite Chiplet
Application:
17/891,690 →
Publication:
US 2024/0063143
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.