Assignment of Assignor's Interest

Recorded: 2022-06-23 Pages: 10

Assignors

NAD, SUDDHASATTWA

Executed: 2022-06-23

YANG, YI

Executed: 2022-06-22

STEILL, JASON

Executed: 2022-06-10

KONG, JIEYING

Executed: 2022-06-06

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Asymmetrical Dielectric-to-Metal Adhesion Architecture for Electronic Packages

Application: 17/848,053 →

Publication: US 2023/0420353

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.