Patent Assignment
Reel/Frame 060597/0589
Assignment of Assignor's Interest
Recorded: 2022-07-22
Pages: 12
Assignors
KONG, JIEYING
Executed: 2022-06-30
ABEYRATNE KURAGAMA, PEUMIE
Executed: 2022-07-01
OMER, ALA
Executed: 2022-07-22
WANG, AO
Executed: 2022-06-30
SENEVIRATNE, DILAN
Executed: 2022-06-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Build Up Material Architecture for Microelectronic Package Device
Application:
17/856,780 →
Publication:
US 2024/0006296
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.