Patent Assignment
Reel/Frame 054300/0045
Assignment of Assignor's Interest
Recorded: 2020-11-06
Pages: 11
Assignors
CHEAH, BOK ENG
Executed: 2020-10-19
ONG, JENNY SHIO YIN
Executed: 2020-11-06
LIM, SEOK LING
Executed: 2020-10-22
OOI, KOOI CHI
Executed: 2020-10-19
KONG, JACKSON CHUNG PENG
Executed: 2020-10-16
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Integrated Bridge for Die-to-Die Interconnects