Patent Assignment
Reel/Frame 054340/0354
Assignment of Assignor's Interest
Recorded: 2020-11-11
Pages: 8
Assignors
LEHRER, MACE
Executed: 2019-11-08
MCKAY, JAMES
Executed: 2019-11-12
BLESSING, CHARLES
Executed: 2019-11-08
Assignee
TTM TECHNOLOGIES INC.
200 EAST SANDPOINTE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
Covered Property
(1)
Systems and Methods for Removing Undesired Metal Within Vias from Printed Circuit Boards
Patent:
11,997,800 →
Application:
17/092,080 →
Publication:
US 2021/0136928
PCT:
PCT/US2020/059510 ↗
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Corrective Assignment to Correct the Assignee's Name to Include Missing Comma in the Name Previously Recorded on Reel 054340 Frame 0354. Assignor(S) Hereby Confirms the Assignment.
Aug 17, 2023
From: LEHRER, MACE; MCKAY, JAMES; BLESSING, CHARLES
To: TTM TECHNOLOGIES, INC.
Reel/Frame 064823/0166 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →