Patent Assignment
Reel/Frame 054342/0517
Assignment of Assignor's Interest
Recorded: 2020-11-12
Pages: 8
Assignors
LEE, KUO-HSING
Executed: 2020-11-06
LIN, CHUN-HSIEN
Executed: 2020-11-06
HSUEH, SHENG-YUAN
Executed: 2020-11-06
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Mram Having Multilayered Interconnect Structures