Patent Assignment
Reel/Frame 054400/0023
Assignment of Assignor's Interest
Recorded: 2020-11-18
Pages: 4
Assignors
HSIEH, HUEI-WEN
Executed: 2020-10-05
KUO, KAI-SHIANG
Executed: 2020-09-30
WENG, CHENG-HUI
Executed: 2020-10-15
CHEN, CHUN-SHENG
Executed: 2020-10-05
CHEN, WEN-HSUAN
Executed: 2020-10-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bi-Layer Alloy Liner for Interconnect Metallization and Methods of Forming the Same