Patent Assignment
Reel/Frame 054514/0120
Assignment of Assignor's Interest
Recorded: 2020-12-02
Pages: 10
Assignors
HIRAYAMA, YUYA
Executed: 2018-09-05
KITAJIMA, TAKAYO
Executed: 2018-09-07
TOMIOKA, KENICHI
Executed: 2018-09-06
KUSHIDA, KEISUKE
Executed: 2018-09-06
KAKITANI, MINORU
Executed: 2018-09-07
SHIMIZU, HIROSHI
Executed: 2018-09-06
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Prepreg, Metal Foil with Resin, Laminate, Printed Wiring Board, and Method for Producing Resin Composition
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 2, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054571/0136 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →