Patent Assignment
Reel/Frame 054571/0136
Change of Name
Recorded: 2020-12-02
Pages: 53
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Prepreg, Metal Foil with Resin, Laminate, Printed Wiring Board, and Method for Producing Resin Composition
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 2, 2020
From: HIRAYAMA, YUYA; KITAJIMA, TAKAYO; TOMIOKA, KENICHI; KUSHIDA, KEISUKE
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 054514/0120 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →