Patent Assignment
Reel/Frame 054606/0338
Assignment of Assignor's Interest
Recorded: 2020-12-10
Pages: 13
Assignors
CHEAH, BOK ENG
Executed: 2020-10-01
KONG, JACKSON CHUNG PENG
Executed: 2020-09-30
ONG, JENNY SHIO YIN
Executed: 2020-09-30
OOI, PING PING
Executed: 2020-10-12
LIM, SEOK LING
Executed: 2020-10-01
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Composite Bridge Die-to-Die Interconnects for Integrated-Circuit Packages