Patent Assignment
Reel/Frame 054675/0386
Assignment of Assignor's Interest
Recorded: 2020-12-17
Pages: 5
Assignors
OTREMBA, RALF
Executed: 2020-12-09
LEE, TECK SIM
Executed: 2020-11-24
SCHIESS, KLAUS
Executed: 2020-12-09
SCHLOEGEL, XAVER
Executed: 2020-12-11
WANG, LEE SHUANG
Executed: 2020-11-20
ZULKIFLI, MOHD HASRUL
Executed: 2020-12-16
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Package, Semiconductor Assembly and Method for Fabricating a Semiconductor Package