Patent Assignment
Reel/Frame 054703/0799
Assignment of Assignor's Interest
Recorded: 2020-12-20
Pages: 3
Assignor
FANG, HSU-NAN
Executed: 2020-12-16
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Including Alignment Material and Method for Manufacturing Semiconductor Package