Patent Assignment
Reel/Frame 054718/0265
Assignment of Assignor's Interest
Recorded: 2020-12-22
Pages: 3
Assignee
LINTEC CORPORATION
23-23 HONCHO, ITABASHI-KU, TOKYO, 173-0001, JAPAN
Covered Property
(1)
Semiconductor Processing Adhesive Tape and Method of Manufacturing Semiconductor Device