Assignment of Assignor's Interest

Recorded: 2020-12-23 Pages: 11

Assignors

KANAI, MASAHIRO

Executed: 2020-12-02

SATO, RIKITO

Executed: 2020-12-02

TAKASUGI, MUNEHIRO

Executed: 2020-12-02

UMEHARA, KOKI

Executed: 2020-12-02

Assignee

MITSUBISHI MATERIALS CORPORATION

2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU, TOKYO, 100-8117, JAPAN

Covered Property (1)

Method of Fragmenting or Method of Generating Cracks in Semiconductor Material, and Method of Manufacturing Semiconductor Material Lumps

Application: 17/255,457 →

Publication: US 2021/0269942

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.