Patent Assignment
Reel/Frame 054739/0359
Assignment of Assignor's Interest
Recorded: 2020-12-23
Pages: 7
Assignors
BAEK, JONGHWAN
Executed: 2020-12-21
PARK, JEONGHYUK
Executed: 2020-12-18
IM, SEUNGWON
Executed: 2020-12-21
LEE, KEUNHYUK
Executed: 2020-12-18
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Dual Cool Power Module with Stress Buffer Layer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 17, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 055315/0350 →
Release of Security Interest in Patents Previously Recorded at Reel 055315, Frame 0350
Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0881 →