Patent Assignment
Reel/Frame 054754/0255
Merger
Recorded: 2020-12-15
Pages: 8
Assignor
DAWNING LEADING TECHNOLOGY INC.
Executed: 2018-11-01
Assignee
KING YUAN ELECTRONICS CO., LTD.
NO.81, SEC. 2, GONGDAO 5TH RD., PUDING VIL., EAST DIST., HSINCHU CITY, 30070, TAIWAN
Covered Property
(1)
Chip Packaging Structure and Manufacturing Method for the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.