Patent Assignment
Reel/Frame 054779/0380
Assignment of Assignor's Interest
Recorded: 2020-12-30
Pages: 4
Assignors
YOUNG, BO-FENG
Executed: 2020-12-09
YEONG, SAI-HOOI
Executed: 2020-12-04
CHIA, HAN-JONG
Executed: 2020-12-09
WANG, SHENG-CHEN
Executed: 2020-12-11
LIN, YU-MING
Executed: 2020-12-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
3D Semiconductor Package Including Memory Array