Patent Assignment
Reel/Frame 054783/0475
Assignment of Assignor's Interest
Recorded: 2020-12-31
Pages: 4
Assignors
CHUNG, MING-TSU
Executed: 2020-12-31
YANG, KU-FENG
Executed: 2020-12-28
WU, TSANG-JIUH
Executed: 2020-12-31
CHIOU, WEN-CHIH
Executed: 2020-12-28
YU, CHEN-HUA
Executed: 2020-12-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
TSV Structure and Method Forming Same