IP Library › Assignment 054789/0071
Patent Assignment
Reel/Frame 054789/0071

Assignment of Assignor's Interest

Recorded: 2020-09-28 Pages: 6
Assignors
KIM, TAE HWA
Executed: 2020-09-15
YOU, MYUNG ILL
Executed: 2020-09-15
Assignees
HYUNDAI MOTOR COMPANY
12, HEOLLEUNG-RO, SEOCHO-GU, SEOUL, 06797, KOREA, REPUBLIC OF
KIA MOTORS CORPORATION
12, HEOLLEUNG-RO, SEOCHO-GU, SEOUL, 06797, KOREA, REPUBLIC OF
Covered Property (1)
Method and Structure to Control the Solder Thickness for Double Sided Cooling Power Module
Application: 17/035,430 →
Publication: US 2021/0327842