Method and structure to control the solder thickness for double sided cooling power module
View Patent ↗In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.
1. A power module including:
a spacer;
a first substrate having a first metal layer including an upper surface having a bonding region in which the spacer is bonded by a first solder; and
at least one wire located in the first solder within the bonding region;
a power semiconductor chip having a first surface which is bonded to the spacer in an opposite direction of the first substrate;
a second substrate having a second metal layer bonded to a second surface of the power semiconductor chip; and
a metal ball disposed in a second solder between a third metal layer included in the second substrate and the power semiconductor chip to secure a minimum height of the second solder by a height of the metal ball.
2. The power module according to claim 1 , wherein the at least one wire has at least a convex portion which is formed toward the spacer.
3. The power module according to claim 2 , wherein a first end portion and a second end portion of the at least a wire are fixed to the upper surface of the first metal layer and a region between the first end portion and the second end portion of the at least a wire is spaced from the upper surface of the first metal layer toward the spacer to form the at least a convex portion.
4. The power module according to claim 2 , wherein a first end portion and a second end portion of the at least a wire and at least a portion between the first end portion and the second end portion of the at least a wire form a plurality of fixing portions fixed to the upper surface of the first metal layer, and a region of the at least a wire corresponding between the plurality of fixing portions are spaced from the upper surface of the first metal layer toward the spacer to form the at least a convex portion.
5. The power module according to claim 1 , wherein the at least one wire includes: a plurality of wires mounted along a circumference of the bonding region.
6. The power module according to claim 2 , wherein the at least a convex portion is disposed between the spacer and the first metal layer.