Patent Assignment
Reel/Frame 054823/0331
Assignment of Assignor's Interest
Recorded: 2021-01-06
Pages: 3
Assignors
JEREZ, JUAN ARTURO
Executed: 2020-10-29
SOTO, MIGUEL CAMARGO
Executed: 2020-10-28
VELAZQUEZ CARDENAS, LUIS ENRIQUE
Executed: 2020-10-27
Assignee
SKYWORKS SOLUTIONS, INC.
5260 CALIFORNIA AVENUE, IRVINE, CALIFORNIA, 92617
Covered Property
(1)
Method of Optimizing Laser Cutting of Wafers for Producing Integrated Circuit Dies