Patent Assignment
Reel/Frame 054865/0111
Assignment of Assignor's Interest
Recorded: 2021-01-08
Pages: 4
Assignors
HUANG, CHIA HSIU
Executed: 2020-12-25
CHEN, CHUN CHEN
Executed: 2020-12-28
CHO, WEI CHIH
Executed: 2020-12-25
YANG, SHAO-LUN
Executed: 2020-12-28
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method for Manufacturing the Same