Patent Assignment
Reel/Frame 054907/0454
Assignment of Assignor's Interest
Recorded: 2021-01-13
Pages: 3
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 1080075, JAPAN
Covered Property
(1)
Three-Dimensional (3D) Shape Modeling Based on Two-Dimensional (2D) Warping
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.