Patent Assignment
Reel/Frame 058999/0446
Assignment of Assignor's Interest
Recorded: 2022-02-14
Pages: 4
Assignor
SONY GROUP CORPORATION
Executed: 2022-02-09
Assignees
SONY GROUP CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
SONY CORPORATION OF AMERICA
25 MADISON AVENUE, NEW YORK, NEW YORK, 10010
Covered Property
(1)
Three-Dimensional (3D) Shape Modeling Based on Two-Dimensional (2D) Warping
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.