Patent Assignment
Reel/Frame 054909/0608
Assignment of Assignor's Interest
Recorded: 2021-01-13
Pages: 3
Assignors
CHANG, CHING-YU
Executed: 2020-09-16
WENG, MING-HUI
Executed: 2020-09-16
CHENG, MING-DA
Executed: 2020-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bump Structure and Method of Manufacturing Bump Structure