Patent Assignment
Reel/Frame 054937/0972
Assignment of Assignor's Interest
Recorded: 2021-01-15
Pages: 6
Assignors
SHIRAOKAWA, YOSHIKATSU
Executed: 2020-12-08
KAMOSHIDA, SHINICHI
Executed: 2020-12-09
KUROKAWA, HIROSHI
Executed: 2020-11-30
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Copper-Clad Laminate, Printed Wiring Board, Semiconductor Package and Method for Producing Copper-Clad Laminate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.