Patent Assignment
Reel/Frame 054944/0222
Assignment of Assignor's Interest
Recorded: 2021-01-18
Pages: 4
Assignors
KAJIKAWA, YASUHIRO
Executed: 2020-10-29
SUGII, HIROSHI
Executed: 2020-10-29
HIRAOKA, YOSHINORI
Executed: 2020-10-29
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Flux Composition, Solder Paste, Solder Joint and Solder Joining Method