Flux composition, solder paste, solder joint and solder joining method
Provided are a flux composition that is applicable without any film formation step, and solder paste, a solder joint and a solder joining method using the flux composition. The flux composition contains 20 wt % or more and 50 wt % or less of an epoxy resin, 15 wt % or more and 45 wt % or less of diallyl bisphenol A, and 1 wt % or more and 30 wt % or less of organic acid.
1. A flux composition comprising:
20 wt % or more and 50 wt % or less of an epoxy resin;
30 wt % or more and 45 wt % or less of diallyl bisphenol A; and
1 wt % or more and 30 wt % or less of organic acid.
2. The flux composition according to claim 1 , further comprising:
0 wt % or more and 10 wt % or less of another phenol-based curing agent;
0 wt % or more and 10 wt % or less of an amine; and
0 wt % or more and 20 wt % or less of a solvent.
3. The flux composition according to claim 1 , further comprising:
0 wt % or more and 2 wt % or less of an amine hydrohalogenic acid salt;
0 wt % or more and 5 wt % or less of an organohalogen compound;
0 wt % or more and 10 wt % or less or a thixotropic agent;
0 wt % or more and 2 wt % or less of a silane coupling agent; and
0 wt % or more and 2 wt % or less of an antifoaming agent.
4. Solder paste comprising a mixture of the flux composition according to claim 1 and solder powder.
5. A solder joint formed using the flux composition according to claim 1 .
6. A solder joining method, comprising forming a solder joint using the flux composition according to claim 1 .
7. The flux composition according to claim 2 , further comprising:
0 wt % or more and 2 wt % or less of an amine hydrohalogenic acid salt;
0 wt % or more and 5 wt % or less of an organohalogen compound;
0 wt % or more and 10 wt % or less or a thixotropic agent;
0 wt % or more and 2 wt % or less of a silane coupling agent; and
0 wt % or more and 2 wt % or less of an antifoaming agent.
8. Solder paste comprising a mixture of the flux composition according to claim 2 and solder powder.
9. Solder paste comprising a mixture of the flux composition according to claim 3 and solder powder.
10. Solder paste comprising a mixture of the flux composition according to claim 7 and solder powder.
11. A solder joint formed using the flux composition according to claim 2 .
12. A solder joint formed using the flux composition according to claim 3 .
13. A solder joint formed using the flux composition according to claim 7 .
14. A solder joining method, comprising forming a solder joint using the flux composition according to claim 2 .
15. A solder joining method, comprising forming a solder joint using the flux composition according to claim 3 .
16. A solder joining method, comprising forming a solder joint using the flux composition according to claim 7 .