Patent Assignment
Reel/Frame 054956/0074
Assignment of Assignor's Interest
Recorded: 2021-01-19
Pages: 2
Assignor
CHUN, JAE HOUB
Executed: 2020-11-27
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUP, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating a Semiconductor Device Having a Trench Exposing a Sidewall of the Contact Plug Aligned with the Sidewall of the Substrate