Patent Assignment
Reel/Frame 054980/0750
Assignment of Assignor's Interest
Recorded: 2021-01-21
Pages: 4
Assignors
NAKAKO, HIDEO
Executed: 2019-07-25
KURAFUCHI, KAZUHIKO
Executed: 2019-08-08
EJIRI, YOSHINORI
Executed: 2019-07-25
ISHIKAWA, DAI
Executed: 2019-07-25
SUGAMA, CHIE
Executed: 2019-07-25
KAWANA, YUKI
Executed: 2019-07-25
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Copper Paste for Pressureless Bonding, Bonded Body and Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jan 21, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055056/0360 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →