Patent Assignment
Reel/Frame 054999/0941
Assignment of Assignor's Interest
Recorded: 2021-01-22
Pages: 7
Assignors
LEE, HYUEKJAE
Executed: 2021-01-15
LEE, JONGHO
Executed: 2021-01-14
KIM, JIHOON
Executed: 2021-01-15
KIM, TAEHUN
Executed: 2021-01-15
PARK, SANGCHEON
Executed: 2021-01-15
SEOL, JINKYEONG
Executed: 2021-01-15
LEE, SANGHOON
Executed: 2021-01-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Packaged Multi-Chip Semiconductor Devices and Methods of Fabricating Same