Packaged multi-chip semiconductor devices and methods of fabricating same
A semiconductor package includes a first connection structure, a first semiconductor chip on an upper surface of the first connection structure, a first molding layer on the upper surface of the first connection structure and surrounding the first semiconductor chip, a first bond pad on the first semiconductor chip, a first bond insulation layer on the first semiconductor chip and the first molding layer and surrounding the first bond pad, a second bond pad directly contacting the first bond pad, a second bond insulation layer surrounding the second bond pad; and a second semiconductor chip on the second bond pad and the second bond insulation layer.
1. A packaged semiconductor device, comprising:
a first connection structure;
a first semiconductor chip on an upper surface of the first connection structure, said first semiconductor chip comprising a substrate, a semiconductor device on the substrate, and a through substrate via (TSV) penetrating through the substrate;
a first molding layer located on the upper surface of the first connection structure and at least partially surrounding the first semiconductor chip;
a first bond pad on the first semiconductor chip;
a first bond insulation layer at least partially surrounding the first bond pad;
a second bond pad directly contacting the first bond pad;
a second bond insulation layer at least partially surrounding the second bond pad; and
a second semiconductor chip on the second bond insulation layer.
2. The device of claim 1 , wherein the second bond insulation layer directly contacts the first bond insulation layer.
3. The device of claim 1 , further comprising:
a connection member penetrating through the first molding layer;
a third bond pad located on the connection member and at least partially surrounded by the first bond insulation layer; and
a fourth bond pad directly contacting the third bond pad and at least partially surrounded by the second bond insulation layer.
4. The device of claim 1 , wherein the first semiconductor chip further comprises:
a first chip pad between the TSV and the first bond pad; and
a second chip pad between the TSV and the first connection structure.
5. The device of claim 1 , wherein the first semiconductor chip comprises a substrate, and a semiconductor device adjacent a surface of the substrate.
6. The device of claim 1 , further comprising:
an external connection terminal on a lower surface of the first connection structure.
7. The device of claim 1 , wherein a lateral surface of the first connection structure is coplanar with a lateral surface of the first molding layer.
8. The device of claim 1 , further comprising a second connection structure between the first molding layer and the first bond insulation layer.
9. The device of claim 1 , wherein a lateral surface of the second semiconductor chip is coplanar with a lateral surface of the first molding layer.
10. The device of claim 1 , further comprising a second molding layer located on the second bond insulation layer and at least partially surrounding the second semiconductor chip.
11. A packaged semiconductor device, comprising:
a redistribution structure;
a solder bump on a first surface of the redistribution structure;
a first semiconductor chip on a second surface of the redistribution structure, said first semiconductor chip comprising a semiconductor substrate, a lower chip pad on a lower surface of the semiconductor substrate, an upper chip pad on an upper surface of the semiconductor substrate, and a through substrate via (TSV) extending through the semiconductor substrate, which extends between the lower chip pad and the upper chip pad;
a first molding layer on the second surface of the redistribution structure and at least partially surrounding the first semiconductor chip;
an electrically conductive connection member (CP) extending through the first molding layer;
a first bond pad on the upper chip pad of the first semiconductor chip;
a first bond insulation layer on an upper surface of the first semiconductor chip and an upper surface of the first molding layer and at least partially surrounding the first bond pad;
a second bond pad contacting the first bond pad;
a second bond insulation layer contacting the first bond insulation layer and at least partially surrounding the second bond pad; and
a second semiconductor chip on the second bond pad and the second bond insulation layer.
12. The device of claim 11 , further comprising:
a third semiconductor chip on the second surface of the redistribution structure and at least partially surrounded by the first molding layer;
a third bond pad located on an upper surface of the third semiconductor chip and at least partially surrounded by the first bond insulation layer; and
a fourth bond pad directly contacting the third bond pad and at least partially surrounded by the second bond insulation layer.
13. The device of claim 11 , wherein the first and second bond insulation layers each comprise a material selected from a group consisting of: silicon oxide, silicon nitride, silicon oxynitride, silicon carbonitride, and combinations thereof.
14. The device of claim 11 , wherein a thermal expansion coefficient of the first molding layer is in a range from 0 ppm/° C. to 10 ppm/° C.
15. A packaged semiconductor device, comprising:
a connection structure;
a first semiconductor chip on an upper surface of the connection structure;
a first bond pad on the first semiconductor chip;
an electrically conductive through substrate via (TSV), which extends through the first semiconductor chip and is electrically connected to the first bond pad;
a first bond insulation layer, which extends on the first semiconductor chip and at least partially surrounds the first bond pad;
a second bond pad directly contacting the first bond pad;
a second bond insulation layer at least partially surrounding the second bond pad;
a second semiconductor chip on the second bond pad and the second bond insulation layer; and
a first molding layer located on the second bond insulation layer and at least partially surrounding the second semiconductor chip.
16. The device of claim 15 , wherein a lateral surface of the first semiconductor chip is coplanar with a lateral surface of the first molding layer.
17. The device of claim 15 , further comprising a second molding layer, which extends between the connection structure and the first bond insulation layer, and at least partially surrounds the first semiconductor chip.
18. The device of claim 15 , further comprising:
a third bond pad located on the first semiconductor chip and at least partially surrounded by the first bond insulation layer;
a fourth bond pad directly contacting the third bond pad and at least partially surrounded by the second bond insulation layer; and
a third semiconductor chip located on the fourth bond pad and the second bond insulation layer and at least partially surrounded by the first molding layer.