Patent Assignment
Reel/Frame 055012/0023
Assignment of Assignor's Interest
Recorded: 2021-01-25
Pages: 4
Assignors
YEW, MING-CHIH
Executed: 2021-01-18
LAI, PO-CHEN
Executed: 2021-01-18
YEH, SHU-SHEN
Executed: 2021-01-19
LIN, PO-YAO
Executed: 2021-01-19
JENG, SHIN-PUU
Executed: 2021-01-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package Having Stress Release Structure