Patent Assignment
Reel/Frame 055018/0203
Assignment of Assignor's Interest
Recorded: 2021-01-18
Pages: 12
Assignee
ICOMETRUE COMPANY, LTD.
18F-3, NO. 32, GAOTIE 2ND RD., ZHUBEI CITY, HSINCHU COUNTY, 302, TAIWAN
Covered Properties
(5)
Logic Drive Based on Multichip Package Comprising Standard Commodity Fpga Ic Chip with Cooperating or Supporting Circuits
Vertical Interconnect Elevator Based on Through Silicon Vias
3D Chip Package Based on Through-Silicon-via Interconnection Elevator
Vertical Interconnect Elevator Based on Through Silicon Vias
Application:
63/012,072 →
3D Chip Package based on Through-Silicon-Via Interconnection Elevator
Application:
63/023,235 →