IP Library › Patent Application 63023235
Patent Application Provisional Small
App. No. 63/023,235 · Confirmation No. 5338

3D Chip Package based on Through-Silicon-Via Interconnection Elevator

Provisional Application Expired
⬇ PDF
Code Description Pages PDF
2020-06-15 APP.FILE.REC Filing Receipt 3 View
2020-05-11 DRW Drawings-only black and white line drawings 199 View
2020-05-11 ADS Application Data Sheet 7 View
2020-05-11 OATH Oath or Declaration filed 2 View
2020-05-11 SPEC Specification 157 View
2020-05-11 WFEE Fee Worksheet (SB06) 2 View
2020-05-11 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
63/023,235
Filed
2020-05-11