Patent Assignment
Reel/Frame 055022/0798
Assignment of Assignor's Interest
Recorded: 2021-01-25
Pages: 4
Assignors
YOUNG, BO-FENG
Executed: 2021-01-05
YEONG, SAI-HOOI
Executed: 2021-01-15
CHIA, HAN-JONG
Executed: 2021-01-05
WANG, SHENG-CHEN
Executed: 2021-01-05
LIN, YU-MING
Executed: 2021-01-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Three-Dimensional Memory Device and Method