Patent Assignment
Reel/Frame 055072/0229
Assignment of Assignor's Interest
Recorded: 2021-01-29
Pages: 3
Assignors
QIAOMING, CAI
Executed: 2021-01-18
YONG, YANG LIE
Executed: 2021-01-18
WEI, CHEN
Executed: 2021-01-15
YU, LU XIAO
Executed: 2021-01-18
Assignee
SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATION
NO. 18 WENCHANG ROAD, BEIJING ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, BEIJING, 100176, CHINA
Covered Property
(1)
Adapter Board and Method for Forming Same, Packaging Method, and Package Structure