IP Library › Assignment 055072/0417
Patent Assignment
Reel/Frame 055072/0417

Assignment of Assignor's Interest

Recorded: 2021-01-29 Pages: 3
Assignor
GANDHIRAMAN, RAMPRASAD
Executed: 2016-04-01
Assignee
UNIVERSITIES SPACE RESEARCH ASSOCIATION
7178 COLUMBIA GATEWAY DRIVE, COLUMBIA, MARYLAND, 21046
Covered Properties (3)
In Situ Tailoring of Material Properties in 3D Printed Electronics
Application: 15/477,700 →
Publication: US 2017/0298516
In Situ Tailoring of Material Properties in 3D Printed Electronics
Application: 17/153,994 →
Publication: US 2021/0254217
In Situ Tailoring of Material Properties in 3D Printed Electronics
Application: 62/317,026 →