IP Library Granted Patent US 11,773,491
Granted Patent B2
US 11,773,491 · App. 17/153,994 · Granted Oct 3, 2023

In situ tailoring of material properties in 3D printed electronics

Inventors: Ramprasad Gandhiraman (Sunnyvale, CA); Meyya Meyyappan (Pacifica, CA); Jessica E. Koehne (Portola Valley, CA)
Assignee: UNIVERSITIES SPACE RESEARCH ASSOCIATION
C23C16/513B33Y10/00B33Y30/00C23C16/4401C23C16/52H05H1/2406H05H1/42H05H1/246
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Quick Facts
Patent No.
US 11,773,491
App. No.
17/153,994
Granted
Oct 3, 2023
Kind
B2
Abstract

Systems and methods for highly reproducible and focused plasma jet printing and patterning of materials using appropriate ink containing aerosol through nozzles with narrow orifice and tubes with controlled dielectric constant connected to high voltage power supply, in the presence of electric field and plasma, that enables morphological and/or bulk chemical modification and/or surface chemical modification of the material in the aerosol and/or the substrate prior to printing, during printing and post printing.

Claims (23)

1. An apparatus for printing crystalline metal surface comprising: a ink input in the form of aerosol from a solution containing one or more metal ion with an oxidation state of 1+ or more;

a gas supply line for one or more gas;

an inner tube and an outer tube, in which the inner and outer tubes are made of dielectric material, and are of equal length, said inner tube terminating at an inner tapered nozzle, said outer tube terminating at an outer tapered nozzle, and in which a plasma discharge is generated and sustained in both said inner tube and said outer tube;

the inner tube carrying aerosolized metal ion and the outer tube carrying said one or more gasses;

one or more metal electrodes disposed along the circumference of the inner tube and connected to a high voltage power supply configured to generate said plasma discharge in both said inner tube and said outer tube;

wherein the plasma discharge is configured to reduce the oxidation state of the metal ion in aerosolized ink to elemental metal and direct the reduced metal towards the substrate in a dry form resulting in printing of conducting crystalline metal surface on a substrate.

2. An apparatus according to claim 1 , wherein the gas comprises a non-reactive gas, a reactive gas, or a combination thereof.

3. An apparatus as recited in claim 2 , wherein the gas comprises a non-reactive gas selected from a group consisting of helium, neon, argon, krypton, and xenon and/or reactive gas selected from a group consisting of hydrogen, nitrogen, acetylene, methane, ammonia, and a combination thereof.

4. An apparatus as recited in claim 1 , wherein the inner and outer tubes of the print head nozzle has same or different thickness.

5. An apparatus as recited in claim 2 , wherein the reactive and non reactive gases can be used i) prior to deposition ii) during deposition and iii) post deposition to create plasma discharge for tailoring material properties.

6. An apparatus as recited in claim 1 , wherein one or more gas, dielectric constant and thickness of the inner and outer tubes, and distribution of electrodes can be appropriately chosen to get high momentum transfer to the material and also used to get highly directional jet to print materials with specific geometries, patterns and properties on 2 dimensional as well as 3 dimensional features.

7. An apparatus as recited in claim 1 , wherein the metal comprises a transition metal.

8. An apparatus as recited in claim 1 , wherein said gases used to generate the plasma and create a reducing environment are selected from the group consisting of helium, argon, hydrogen, nitrogen, or any hydrogen-containing reducing compounds.

9. An apparatus as recited in claim 1 , wherein said gas used to generate the plasma is made to flow at a rate of from 10 sccm to 5000 sccm.

10. An apparatus as recited in claim 1 , wherein the plasma is generated at atmospheric pressure and the temperature on the substrate falls in a range of 35 deg C. to 200 deg C.

11. An apparatus as recited in claim 1 , wherein the three-dimensional conducting structure of metal is printed and grown with specific geometries in two and three dimensions.

12. An apparatus as recited in claim 1 , further comprising printing and post treating the printed material to further reduce the oxidation state of the material and form crystalline structure.

13. A method of printing crystalline metal on a substrate, the method comprising:

(a) introducing a material comprising metal ion with a oxidation state of 1+ or more into said inner dielectric tube of said apparatus of claim 1 ;

(b) exposing said material comprising metal ion to atmospheric pressure plasma generated by said electrodes of said apparatus of claim 1 , thereby reducing the oxidation state of the material to form elemental metal;

(c) directing the reduced elemental metal towards a substrate to print conducting crystalline metal onto said substrate.

14. The method of claim 13 , wherein said plasma can be treated on printed metal to further change the morphology, oxidation state, chemical bonding, spin state, crystallographic structure, strain, thickness, or a combination thereof.

15. The method of claim 13 , wherein the said metal upon printing on the surface is crystalline and conducting in nature.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2021
From: GANDHIRAMAN, RAMPRASAD
To: UNIVERSITIES SPACE RESEARCH ASSOCIATION
Reel/Frame 055072/0417 →
Continuity (3)
Division 15477700 · Apr 3, 2017
Provisional Application 62317026 · Apr 1, 2016
Related Publication 20210254217A1 · Aug 19, 2021
Cited By (1)
US 12,325,040