Patent Assignment
Reel/Frame 055077/0367
Assignment of Assignor's Interest
Recorded: 2021-01-29
Pages: 3
Assignors
LO, TENG-YUAN
Executed: 2021-01-12
CHUANG, LIPU KRIS
Executed: 2021-01-11
PAN, HSIN-YU
Executed: 2021-01-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method