Patent Assignment
Reel/Frame 055086/0451
Assignment of Assignor's Interest
Recorded: 2021-01-29
Pages: 4
Assignors
CHO, WEI-CHIH
Executed: 2021-01-28
YANG, SHAO-LUN
Executed: 2021-01-28
YEH, CHUN-HUNG
Executed: 2021-01-28
LU, TSUNG-WEI
Executed: 2021-01-28
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same