Patent Assignment
Reel/Frame 055109/0574
Assignment of Assignor's Interest
Recorded: 2021-02-02
Pages: 5
Assignors
EOM, JOOYANG
Executed: 2020-11-03
IM, SEUNGWON
Executed: 2020-11-03
LEE, BYOUNGOK
Executed: 2020-11-03
YOO, INPIL
Executed: 2020-11-11
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Direct-Cooling for Semiconductor Device Modules
Application:
16/949,894 →
Publication:
US 2022/0157688
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 17, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 055315/0350 →
Release of Security Interest in Patents Previously Recorded at Reel 055315, Frame 0350
Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0881 →