Patent Assignment
Reel/Frame 055131/0877
Assignment of Assignor's Interest
Recorded: 2021-02-03
Pages: 13
Assignors
PHILLIPS, RICHARD J.
Executed: 2018-08-06
DAGGOLU, PARTHIV
Executed: 2019-01-28
GITLIN, ERIC MICHAEL
Executed: 2018-10-23
STANDLEY, ROBERT W.
Executed: 2018-08-07
LEE, HYUNGMIN
Executed: 2018-08-03
ZHANG, NAN
Executed: 2018-10-12
RYU, JAE-WOO
Executed: 2018-08-02
Assignee
GLOBALWAFERS CO., LTD.
NO. 8. INDUSTRIAL EAST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Methods for Forming Single Crystal Silicon Ingots with Improved Resistivity Control
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Employment Agreement
Feb 2, 2021
From: BASAK, SOUBIR
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 055205/0200 →
Change of Name
Feb 3, 2021
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON, INC.
Reel/Frame 055209/0053 →
Separation Agreement
Feb 3, 2021
From: SUNEDISON, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED
Reel/Frame 055209/0180 →
Assignment of Assignor's Interest
Feb 3, 2021
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LTD; MEMC ELECTRONIC MATERIALS S.P.A
To: GLOBALWAFERS CO., LTD.
Reel/Frame 055209/0381 →