IP Library › Assignment 055137/0960
Patent Assignment
Reel/Frame 055137/0960

Assignment of Assignor's Interest

Recorded: 2021-02-03 Pages: 3
Assignors
ZOU, PENG
Executed: 2021-02-02
ZIAI, SYRUS
Executed: 2021-02-02
Assignee
NUVIA, INC.
2841 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Vertically Integrated Device Stack Including System on Chip and Power Management Integrated Circuit
Application: 17/096,828 →
Publication: US 2021/0151374
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 4, 2020
From: ZOU, PENG; ZIAI, SYRUS
To: NUVIA INC.
Reel/Frame 054547/0631 →
Merger Mar 18, 2021
From: NILE ACQUISITION CORPORATION
To: NUVIA, INC.
Reel/Frame 055639/0792 →
Assignment of Assignor's Interest Sep 13, 2022
From: NUVIA, INC.
To: QUALCOMM INCORPORATED
Reel/Frame 061081/0027 →