Patent Assignment
Reel/Frame 055152/0591
Assignment of Assignor's Interest
Recorded: 2021-02-04
Pages: 7
Assignors
KIM, DONHGO
Executed: 2021-01-13
SHIM, JONGBO
Executed: 2021-01-13
PARK, HWAN PIL
Executed: 2021-01-13
YIM, CHOONGBIN
Executed: 2021-01-13
KIM, JUNGWOO
Executed: 2021-01-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Substrate and Semiconductor Package Including the Same