Semiconductor package substrate and semiconductor package including the same

1. A semiconductor package substrate, comprising:

a substrate having a bottom surface including a cavity structure defined therein, the cavity structure including a floor surface, a first cavity and a second cavity, the first and second cavities having different widths from each other; and

a passive device structure having at least a partial portion of the passive device structure disposed in the cavity structure,

wherein the passive device structure includes a first passive device and a second passive device that are each connected to the floor surface of the cavity structure,

wherein at least partial portions of the first passive device and the second passive device vertically overlap each other,

wherein a longest dimension of the first passive device is perpendicular to a longest dimension of the second passive device,

wherein the first passive device is disposed in the first cavity and is not disposed in the second cavity, and

wherein the second passive device is disposed in the second cavity and is not disposed in the first cavity.

2. The semiconductor package substrate of claim 1 , further comprising:

a coupling terminal that protrudes downwardly from the bottom surface of the substrate,

wherein a protrusion height is in a range of about 10 μm about 140 μm, the protrusion height is defined as a distance between the bottom surface of the substrate and a lowermost point of the coupling terminal.

3. The semiconductor package substrate of claim 1 , wherein the first passive device and the second passive device extend longitudinally in parallel along a first direction.

4. The semiconductor package substrate of claim 3 , wherein a total length in the first direction of the first passive device is less than a total length in the first direction of the second passive device.

5. The semiconductor package substrate of claim 3 , wherein:

the first passive device includes a plurality of first electrodes disposed at opposite lateral ends and a first dielectric layer disposed between the plurality of first electrodes;

the second passive device includes a plurality of second electrodes disposed at opposite lateral ends and a second dielectric layer disposed between the plurality of second electrodes;

the plurality of first electrodes do not vertically overlap the plurality of second electrodes; and

the plurality of first electrodes vertically overlap the second dielectric layer.

6. The semiconductor package substrate of claim 1 , wherein:

the first passive device longitudinally extends in a first direction; and

the second passive device longitudinally extends in a second direction intersecting the first direction.

7. The semiconductor package substrate of claim 6 , wherein:

the first passive device includes a plurality of first electrodes disposed at opposite lateral ends and a first dielectric layer disposed between the plurality of first electrodes;

the second passive device includes a plurality of second electrodes disposed at opposite lateral ends and a second dielectric layer disposed between the plurality of second electrodes;

the plurality of first electrodes do not vertically overlap the plurality of second electrodes; and

a partial portion of the first dielectric layer vertically overlaps the second dielectric layer.

8. The semiconductor package substrate of claim 7 , wherein the plurality of first electrodes and the plurality of second electrodes are spaced apart from a sidewall of the cavity structure.

9. The semiconductor package substrate of claim 1 , further comprising:

a plurality of first conductive pads and a plurality of second conductive pads disposed on the floor surface of the cavity structure or the bottom surface of the substrate,

wherein the plurality of first conductive pads is positioned at a level that is different from a level of the plurality of second conductive pads, and

wherein the first passive device and the second passive device are connected to the plurality of first conductive pads and the plurality of second conductive pads, respectively.

10. The semiconductor package substrate of claim 1 , wherein:

the cavity structure includes a plurality of cavity structures disposed on the bottom surface of the substrate; and

the passive device structure is disposed in each of the plurality of cavity structures.

11. A semiconductor package substrate, comprising:

a substrate having a bottom surface including a cavity structure defined therein, the cavity structure includes a first cavity and a second cavity, the first and second cavities having a step difference therebetween; and

a passive device structure disposed in the cavity structure, the passive device structure including a first passive device and a second passive device that are each connected to a floor surface of the cavity structure,

wherein the first cavity and the second cavity have different widths from each other, and

wherein the first passive device is disposed in the first cavity and is not disposed in the second cavity, and

wherein the second passive device is disposed in the second cavity and is not disposed in the first cavity, and

wherein a longest dimension of the first passive device is perpendicular to a longest dimension of the second passive device.

12. The semiconductor package substrate of claim 11 , wherein:

the first passive device and the second passive device are spaced apart from each other in a direction perpendicular to the bottom surface of the substrate; and

at least a partial portion of the first passive device and the second passive device vertically overlap each other.

13. The semiconductor package substrate of claim 11 , wherein:

the first passive device and the second passive device extend longitudinally in parallel along a first direction; and

a total length in the first direction of the first passive device is less than a total length in the first direction of the second passive device.

14. The semiconductor package substrate of claim 11 , wherein:

the first passive device extends longitudinally in a first direction; and

the second passive device extends longitudinally in a second direction intersecting the first direction.

15. The semiconductor package substrate of claim 11 , wherein:

the first passive device includes a plurality of first electrodes disposed at opposite lateral ends and a first dielectric layer disposed between the plurality of first electrodes;

the second passive device includes a plurality of second electrodes disposed at opposite lateral ends and a second dielectric layer disposed between the plurality of second electrodes; and

the plurality of first electrodes do not vertically overlap the plurality of second electrodes.

16. The semiconductor package substrate of claim 11 , further comprising:

a coupling terminal that protrudes downwardly from the bottom surface of the substrate,

wherein a protrusion height is in a range of about 10 μm to about 140 μm, the protrusion height is defined as a distance between the bottom surface of the substrate and a lowermost point of the coupling terminal.

17. The semiconductor package substrate of claim 11 , wherein:

the first passive device is spaced apart from a sidewall of the first cavity; and

the second passive device is spaced apart from a sidewall of the second cavity.

18. The semiconductor package substrate of claim 11 , wherein:

the cavity structure includes a plurality of cavity structures disposed on the bottom surface of the substrate; and

the passive device structure is disposed in each of the plurality of cavity structures.

19. A semiconductor package, comprising:

a substrate having a bottom surface including a cavity structure defined therein, the cavity structure including a first cavity and a second cavity, the first and second cavities having a step difference therebetween;

a plurality of first conductive pads disposed on a floor surface of the first cavity;

a plurality of second conductive pads disposed on a floor surface of the second cavity;

a plurality of conductive vias disposed in the substrate, each of the plurality of conductive vias is connected to one of the plurality of first and second conductive pads;

a plurality of coupling terminals disposed on the bottom surface of the substrate;

a first passive device disposed in the first cavity and electrically connected to the plurality of first conductive pads, the first passive device is not disposed in the second cavity; and

a second passive device disposed in the second cavity and electrically connected to the plurality of second conductive pads, the second passive device is not disposed in the first cavity,

wherein each of the first and second passive devices includes a plurality of electrodes disposed at opposite lateral ends and a dielectric layer disposed between the electrodes, at least a partial portion of the first and second passive devices vertically overlapping each other,

wherein a longest dimension of the first passive device is perpendicular to a longest dimension of the second passive device.

20. The semiconductor package of claim 19 , wherein:

the first cavity and the second cavity have different widths from each other; and

the first passive device and the second passive device have different lengths from each other.